Thermal investigation of a high brightness LED array package assembly for various placement algorithms
Authors:
- K.C. YungKYK.C. Yung
- H. LiemHLH. Liem
- H.S. ChoyHCH.S. Choy
- Z.X. CaiZCZ.X. Cai
- 1 February 2014
- journal article
- Published by Elsevier in Applied Thermal Engineering
- Vol. 63 (1) , 105-118
Abstract
No abstract availableKeywords
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