Deposition and structure of W–Cu multilayer coatings by magnetron sputtering
Authors:
- 15 October 2003
- journal article
- Published by IOP Publishing in Journal of Physics D: Applied Physics
- Vol. 36 (21) , 2709-2713
Abstract
W–Cu–W multilayer metallic coatings are designed and deposited by dc magnetron sputtering on an Fe substrate. Correlations between the deposition parameters, such as target power and Ar gas pressure, and the film characteristics are investigated. Especially, deposition parameters for a dense W–Cu multilayer coating are discussed. The coatings exhibit small grain sizes and a dense surface structure for high target power and low argon pressure, leading to dense and well adhesive films.Keywords
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