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Effect of contact pressure and thermal degradation on the sealability of O-ring
Home
Publications
Effect of contact pressure and thermal degradation on the sealability of O-ring
Effect of contact pressure and thermal degradation on the sealability of O-ring
Author:
KY
K Yokoyama
K Yokoyama
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1 April 1998
journal article
Published by
Elsevier
in
JSAE Review
Vol. 19
(2)
,
123-128
DOI:
10.1016/s0389-4304(97)00070-2
Abstract
No abstract available
Keywords
THERMAL DEGRADATION
CONTACT PRESSURE
DESIGN GUIDELINES
SEALABILITY
RING CONTACT
RING SEAL
ASSEMBLY STRUCTURE
SEAL RELIABLE
Cited
Cited by 28 articles
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