Warpage: Causes, manufacturing processes and future challenges: A review

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Abstract
Currently, in the manufacturing industry, there are many different component manufacturing processes. Each of them has its own advantages and disadvantages. One phenomenon present in some processes is known as warpage. Essentially, warpage is unwanted deformation in a component caused by internal stresses, thermal variations, uneven cooling of the part, the presence of moisture or the release of residual stresses in the material. Although it is a common problem in some engineering fields, it occurs mainly in processes such as injection moulding, compression moulding and 3D printing. There are different measurement and mitigation techniques that are adapted to each process. This paper discusses the causes of the phenomenon and current and future mitigation techniques. Additionally, an overview of upcoming techniques aimed at fully mitigating and measuring this phenomenon in real time during manufacturing processes is presented.
Funding Information
  • Kautex Textron GmbH. (Kautex Lightweight structures Lab)

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