Thermal stability of copper reinforced by nanoscaled and microscaled alumina particles investigated by internal friction
Authors:
- Zuzanka TrojanováZTZuzanka Trojanová
- Hans FerkelHFHans Ferkel
- Pavel LukáčPavel Lukáč
- Jürgen NaserJNJürgen Naser
- Werner RiehemannWRWerner Riehemann
- 1 April 1999
- journal article
- Published by Elsevier in Scripta Materialia
- Vol. 40 (9) , 1063-1069
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Grain stabilisation of copper with nanoscaled Al2O3-powderMaterials Science and Engineering: A, 1997
- Bonding of alumina ceramics with nanoscaled alumina powdersNanostructured Materials, 1996
- Processing and Properties of Particle Reinforced Al-SiC MMCsKey Engineering Materials, 1995
- Theory of Mechanical Damping Due to DislocationsJournal of Applied Physics, 1956