Nondestructive characterization of sub-surface damage in rotational ground silicon wafers by laser acoustics
Authors:
- Dietmar PaehlerDPDietmar Paehler
- Dieter SchneiderDSDieter Schneider
- Maurice HerbenMHMaurice Herben
- 1 February 2007
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 84 (2) , 340-354
Abstract
No abstract availableKeywords
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