Hot Spots Caused by Voids and Cracks in the Chip Mountdown Medium in Power Semiconductor Packaging
Authors:
- A. YermanAYA. Yerman
- J. BurgessJBJ. Burgess
- C. NeugebauerCNC. Neugebauer
- 1 December 1983
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 6 (4) , 473-479