Effect of nanosilica on the dielectric properties and thermal stability of polyimide/SiO2nanohybrid

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Abstract
New polyimide–silica (PI–SiO2) nanohybrids were prepared by the reaction of bis(5-amino-1-naphthoxy) diphenylsilane (5-APS) with commercially available 4,4’-(Hexafluoroisopropylidene) diphthalic anhydride (6-FDA) in the presence of 3-aminopropyl triethoxysilane as a coupling agent and tetraethylorthosilicate (TEOS) as precursor of inorganic network. Hybrid thin films with 5–50 wt.% silica content were synthesized. The prepared PI–SiO2 films were characterized by Fourier transform infrared spectroscopy and energy dispersive X-ray spectroscopy. The morphology and crystallinity of these hybrid systems were investigated by transmission electron microscopy and XRD analysis. Thermal properties of the nanohybrids were evaluated by thermogravimetric analysis and dynamic mechanical thermal analysis techniques. The optical constants (n and k) and dielectric parameters ( and ) were calculated from IR reflection spectra by employing the Kramers–Kronig dispersion relations. Under proper condition, the silica particle size was in the range of 50–70 nm for the prepared hybrids. The results showed that presence of silica severely modified the properties of samples.

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