Thermal contact resistance between the surfaces of silicon and copper crucible during electron beam melting
Authors:
- Shutao WenSWShutao Wen
- Yi TanYTYi Tan
- Shuang ShiSSShuang Shi
- Wei DongWDWei Dong
- Dachuan JiangDJDachuan Jiang
- Jiao LiaoJLJiao Liao
- Zhi ZhuZZZhi Zhu
- 1 December 2013
- journal article
- Published by Elsevier in International Journal of Thermal Sciences
- Vol. 74, 37-43
Abstract
No abstract availableKeywords
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