Analysis of transport phenomena governing interfacial bonding and void dynamics during thermoplastic tow-placement
Authors:
- R. PitchumaniRPR. Pitchumani
- S. RanganathanSRS. Ranganathan
- R.C. DonRDR.C. Don
- J.W. GillespieJGJ.W. Gillespie
- M.A. LamontiaMLM.A. Lamontia
- 1 June 1996
- journal article
- Published by Elsevier in International Journal of Heat and Mass Transfer
- Vol. 39 (9) , 1883-1897
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
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