Methods of analysing thermomechanical stress in plastic packages for integrated circuits
Authors:
- 1 October 1995
- journal article
- Published by Elsevier in Journal of Materials Processing Technology
- Vol. 54 (1-4) , 199-204
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Piezoresistive Stress Sensors for Structural Analysis of Electronic PackagesJournal of Electronic Packaging, 1991
- A graphical representation of the piezoresistance coefficients in siliconIEEE Transactions on Electron Devices, 1982