Abstract
A partition-recomposition methodology based on internal port concept associated to auxiliary sources, is proposed for electromagnetic (EM) analysis of SiP (system-in-package) off-chip and on-chip passive circuitry towards optimized passive and active frequency and time domain co-simulation. Attributes of internal ports and associated de-embedding procedures for local ground references are discussed. Application of the proposed methodology to off-chip SiP multi-conductors and functional components is presented. A broadband extraction methodology is applied to derive, from EM simulation results or measurement data of passive structures, Spice-compatible models for transient/SSN (simultaneous switching noise) analysis.

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