Melting and solidification properties of the nanoparticles of Sn3.0Ag0.5Cu lead-free solder alloy
Authors:
- Changdong ZouCZChangdong Zou
- Yulai GaoYGYulai Gao
- Bin YangBYBin Yang
- Qijie ZhaiQZQijie Zhai
- 30 April 2010
- journal article
- Published by Elsevier in Materials Characterization
- Vol. 61 (4) , 474-480
Abstract
No abstract availableKeywords
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