High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package
Authors:
- Adwait InamdarAIAdwait Inamdar
- Yu-Hsiang YangYYYu-Hsiang Yang
- Alexandru PrisacaruAPAlexandru Prisacaru
- Przemyslaw GromalaPGPrzemyslaw Gromala
- Bongtae HanBHBongtae Han
- 1 June 2021
- journal article
- research article
- Published by Elsevier in Polymer Degradation and Stability
- Vol. 188
Abstract
No abstract availableKeywords
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