Durability of Enamel Bonding Using Two-step Self-etch Systems on Ground and Unground Enamel

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Abstract
The effect of surface preparation was adhesive-dependent. Improvements in resin-enamel bond strength after enamel preparation were observed only for AdheSE and Optibond Solo plus Self-Etch Primer. Among the self-etch systems, mild, self-etch Clearfil SE Bond showed the highest bond strength values. No degradation of resin-enamel bonds was observed after 12 months of water storage, regardless of the adhesive tested. This study examined the early and long-term microtensile bond strengths (μTBS) and interfacial enamel gap formation (IGW) of two-step self-etch systems to unground and ground enamel. Resin composite (Filtek Z250) buildups were bonded to proximal enamel surfaces (unground, bur-cut or SiC-treated enamel) of third molars after the application of four self-etch adhesives: a mild (Clearfil SE Bond [SE]), two moderate (Optibond Solo Plus Self-Etch Primer [SO] and AdheSE [AD]) and a strong adhesive (Tyrian Self Priming Etchant + One Step Plus [TY]) and two etch-and-rinse adhesive systems (Single Bond [SB] and Scotchbond Multi-Purpose Plus [SBMP]). Ten tooth halves were assigned for each adhesive. After storage in water (24 hours/37°C), the bonded specimens were sectioned into beams (0.9 mm2) and subjected to μTBS (0.5 mm/minute) or interfacial gap width measurement (stereomi-croscope at 400×) either immediately (IM) or after 12 months (12M) of water storage. The data were analyzed by three-way repeated measures ANOVA and Tukey's test (α=0.05). No gap formation was observed in any experimental condition. The μTBS in the Si-C paper and diamond bur groups were similar and greater than the unground group only for the moderate self-etch systems (SO and AD). No reductions in bond strength values were observed after 12 months of water storage, regardless of the adhesive evaluated.

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