Application of thermal analysis for the investigation of epoxy resins
Authors:
- 1 January 1984
- journal article
- Published by Elsevier in Progress in Organic Coatings
- Vol. 12 (1) , 27-116
Abstract
No abstract availableKeywords
This publication has 69 references indexed in Scilit:
- Determination of cure times and activation energies of one-container epoxy resin systems by isothermal DSCThermochimica Acta, 1980
- A thermoanalytical study of the cure characteristics of an epoxy resin systemBritish Polymer Journal, 1979
- Differential scanning calorimetry of epoxy cure: isothermal cure kineticsThermochimica Acta, 1976
- Isothermal transitions of a thermosetting systemJournal of Applied Polymer Science, 1974
- Kinetics of epoxy cure: 2. The system bisphenol-A diglycidyl ether/polyamidePolymer, 1972
- Thermal conductivity, specific heat, and dynamic mechanical behavior of diglycidyl ether of bisphenol a cured with m‐phenylenediamineJournal of Applied Polymer Science, 1969
- Chemistry of epoxide resins. XVII. Influence of structure and curing conditions on the density, degree of cure, and glass transition temperature during the curing of epoxide resinsJournal of Applied Polymer Science, 1969
- Epoxy polymers. III. Factors affecting the cureJournal of Applied Polymer Science, 1968
- The Application of Differential Thermal Analysis to the Study of Reaction Kinetics1Journal of the American Chemical Society, 1957
- THE THERMAL DECOMPOSITION OF GASEOUS ETHYLENE OXIDEJournal of the American Chemical Society, 1929