Diffusion bonding of a Cu–Cr–Zr alloy to stainless steel and tungsten using nickel as an interlayer
Authors:
- I.S. BatraIBI.S. Batra
- G.B. KaleGKG.B. Kale
- T.K. SahaTST.K. Saha
- A.K. RayARA.K. Ray
- J. DeroseJDJ. Derose
- J. KrishnanJKJ. Krishnan
- 1 March 2004
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 369 (1-2) , 119-123
Abstract
No abstract availableKeywords
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