Magnetic and ultrasonic vibration dual-field assisted ultra-precision diamond cutting of high-entropy alloys
Authors:
- Yintian XingYXYintian Xing
- Yue LiuYue Liu
- Tengfei YinTYTengfei Yin
- Denghui LiDLDenghui Li
- Zhanwen SunZSZhanwen Sun
- Changxi XueCXChangxi Xue
- Wai Sze YipWYWai Sze Yip
- Suet ToSTSuet To
- 3 September 2024
- journal article
- research article
- Published by Elsevier in International Journal of Machine Tools and Manufacture
- Vol. 202
Abstract
No abstract availableKeywords
Funding Information
- Science, Technology and Innovation Commission of Shenzhen Municipality (JCYJ20210324131214039)
- National Natural Science Foundation of China
- Hong Kong Polytechnic University
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