A Stackable LTE Chip for Cost-effective 3D Systems
Authors:
- Walid LafiWLWalid Lafi
- Didier LattardDLDidier Lattard
- Ahmed JerrayaAJAhmed Jerraya
Open Access
- 1 January 2012
- journal article
- Published by Information Processing Society of Japan in IPSJ Transactions on System and LSI Design Methodology
- Vol. 5, 2-13
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- Modeling the economics of testing: a DFT perspectiveIEEE Design & Test of Computers, 2002