Electrical Conductivity for Quality Evaluation of Popcorn Kernels subjected to Mechanical Damage
- 1 March 2007
- journal article
- Published by Elsevier in Biosystems Engineering
- Vol. 96 (3) , 361-367
Abstract
No abstract availableKeywords
This publication has 14 references indexed in Scilit:
- Efeito da Debulha e da Classificação sobre o Tamanho e a Qualidade de Sementes de Milho-PipocaRevista Brasileira de Milho e Sorgo, 2003
- Qualidade Fisiológica de Sementes de Milho-Doce Submetidas à Debulha, com Diferentes Graus de UmidadeRevista Brasileira de Milho e Sorgo, 2002
- AVALIAÇÃO DE DANO MECÂNICO EM SEMENTES DE FEIJÃO POR MEIO DE CONDUTIVIDADE ELÉTRICARevista Brasileira de Engenharia Agrícola E Ambiental, 1999
- AN ELECTRICAL CONDUCTIVITY METHOD SUITABLE FOR QUANTITATIVE MECHANICAL DAMAGE EVALUATIONTransactions of the ASAE, 1998
- Technical Notes: Breakage Susceptibility of Corn of Different Stress-crack CategoriesTransactions of the ASAE, 1993
- Desiccation Tolerance in Maturing Maize Seed: Membrane Phospholipid Composition and Thermal PropertiesCrop Science, 1991
- IMPACT DAMAGE TO SOYBEAN SEED AS AFFECTED BY SURFACE HARDNESS AND SEED ORIENTATIONTransactions of the ASAE, 1990
- Mechanism of popcorn poppingJournal of Cereal Science, 1983
- Factors Affecting Mechanical Damage of Navy BeansTransactions of the ASAE, 1973
- Corn Kernel Damage Due to High Velocity ImpactTransactions of the ASAE, 1972