Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method
- 1 January 2017
- journal article
- research article
- Published by Institute of Electronics, Information and Communications Engineers (IEICE) in IEICE Transactions on Electronics
- Vol. E100.C (2) , 156-160
Abstract
Japan's largest platform for academic e-journals: J-STAGE is a full text database for reviewed academic papers published by Japanese societiesKeywords
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