Wafer level integration of an advanced logic-memory system through 2nd generation CoWoS® technology
Authors:
- W. Chris ChenWCW. Chris Chen
- Clark HuCHClark Hu
- K. C. TingKTK. C. Ting
- Vincent WeiVWVincent Wei
- T. H. YuTYT. H. Yu
- S. Y. HuangSHS. Y. Huang
- V.C.Y. ChangVCV.C.Y. Chang
- C. T. WangCWC. T. Wang
- S. Y. HouSHS. Y. Hou
- C. H. WuCWC. H. Wu
- Doug YuDYDoug Yu
- 1 June 2017
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. T54-T55
Abstract
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