Prediction and measurement for grinding force in wafer self-rotational grinding
Authors:
- Hongfei TaoHTHongfei Tao
- Yuanhang LiuYLYuanhang Liu
- Dewen ZhaoDZDewen Zhao
- Xinchun LuXLXinchun Lu
- 16 June 2023
- journal article
- research article
- Published by Elsevier in International Journal of Mechanical Sciences
- Vol. 258
Abstract
No abstract availableKeywords
Funding Information
- National Natural Science Foundation of China (51991372, 52075283)
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