Dislocation reconfiguration during creep deformation of an Al-Cu-Li alloy via electropulsing
Authors:
- Chang ZhouCZChang Zhou
- Lihua ZhanLZLihua Zhan
- He LiHLHe Li
- Chunhui LiuCLChunhui Liu
- Yongqian XuYXYongqian Xu
- Bolin MaBMBolin Ma
- Youliang YangYYYouliang Yang
- Minghui HuangMHMinghui Huang
- 30 May 2022
- journal article
- research article
- Published by Elsevier in Journal of Materials Science & Technology
- Vol. 130, 27-34
Abstract
No abstract availableKeywords
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