Effects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applications
Authors:
- 1 July 2000
- journal article
- Published by American Vacuum Society in Journal of Vacuum Science & Technology A
- Vol. 18 (4) , 1207-1210
Abstract
Effects of a new combination of additives in acid electroplating solution on the properties of Cu thin films have been investigated. The electroplated Cu films exhibit an excellent superfilling behavior. 0.18 μm vias with an aspect ratio exceeding 5 were filled completely without any void or seam. Strong (111) texture was found for the electroplated Cu films. The resistivity of a 450-nm-thick Cu film was measured to be 1.84 μΩ cm.Keywords
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