Nanotwin formation and its physical properties and effect on reliability of copper interconnects
Authors:
- Di XuDXDi Xu
- Vinay SriramVSVinay Sriram
- Vidvuds OzolinsVOVidvuds Ozolins
- Jenn-Ming YangJYJenn-Ming Yang
- K.N. TuKTK.N. Tu
- Gery R. StaffordGSGery R. Stafford
- Carlos BeauchampCBCarlos Beauchamp
- Inka ZienertIZInka Zienert
- Holm GeislerHGHolm Geisler
- Petra HofmannPHPetra Hofmann
- Ehrenfried ZschechEZEhrenfried Zschech
- 1 October 2008
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 85 (10) , 2155-2158
Abstract
No abstract availableKeywords
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