High Sn solder reaction with Cu metallization
Authors:
- 1 July 1996
- journal article
- Published by Elsevier in Scripta Materialia
- Vol. 35 (1) , 65-69
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Three-dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and CuApplied Physics Letters, 1995
- Microstructure evolution of eutectic Sn-Ag solder jointsJournal of Electronic Materials, 1994
- Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: Experimental analysisJournal of Electronic Materials, 1994
- The effect of aging on microstructure, room temperature deformation, and fracture of Sn-Bi/Cu solder jointsJournal of Electronic Materials, 1994
- Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatingsJournal of Electronic Materials, 1994