Electromigration Behavior of Cu/Sn-58Bi/Cu Solder Joints Under Alternating Current Stressing

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Abstract
The electromigration (EM) behavior of ball grid array (BGA) Cu/Sn-58Bi/Cu solder joints under alternating current (AC) stressing with different frequencies at a current density 1.2×10 4 A/cm 2 was investigated systematically in this study. The microstructure and shear performance of solder joints after EM were analyzed through scanning electron microscope (SEM) and dynamic mechanical analyze (DMA), respectively. The results show that (1) The growth of intermetallic compounds (IMC) after electromagnetic (EM) under AC stressing presents both polar and non-polar modes. In the polar growth of IMC processes, the thickness of IMC increases with rising numerical value frequency of AC; (2) The shear strength of solder joints after EM with AC stressing shows a slightly decreased, while they are close at different AC frequencies; (3) With the increase in AC frequency, the fracture location of the solder joints shifts from the solder matrix to the interface between the solder and IMC layer, and the fracture mode shows ductile-brittle transitions.

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