The composition and structure of electrodeposited copper-tin alloy films
Authors:
- T.N. VorobyovaTVT.N. Vorobyova
- V.P. BobrovskayaVBV.P. Bobrovskaya
- V.V. SviridovVSV.V. Sviridov
- 30 November 1997
- journal article
- Published by Elsevier in Metal Finishing
- Vol. 95 (11) , 14-20
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- Diffusion of bismuth and gold in nanocrystalline copperJournal of Applied Physics, 1993