Hollow Cathode Plasma-Enhanced Atomic Layer Deposition of Silicon Nitride Using Pentachlorodisilane

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Abstract
In this work, a novel chlorodisilane precursor, pentachlorodisilane (PCDS, HSi2Cl5), was investigated for the growth of silicon nitride (SiNx) via hollow cathode plasma-enhanced atomic layer deposition (PEALD). A well-defined self-limiting growth behavior was successfully demonstrated over the growth temperature range of 270–360 °C. At identical process conditions, PCDS not only demonstrated approximately >20% higher growth per cycle than that of a commercially available chlorodisilane precursor, hexachlorodisilane (Si2Cl6), but also delivered a better or at least comparable film quality determined by characterizing the refractive index, wet etch rate, and density of the films. The composition of the SiNx films grown at 360 °C using PCDS, as determined by X-ray photoelectron spectroscopy, showed low O content (∼2 at. %) and Cl content (x films without a significant amount of Si–H bonds originating from the precursor molecules. The possible surface reaction pathways of the PEALD SiNx using PCDS on the surface terminated with amine groups (−NH2 and −NH−) are proposed. The PEALD SiNx films grown using PCDS also exhibited a leakage current density as low as 1–2 nA/cm2 at 2 MV/cm and a breakdown electric field as high as ∼12 MV/cm.
Funding Information
  • Dow Chemical Company

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