Rankings
Publications
Search Publications
Cited-by Search
Sources
Publishers
Scholars
Scholars
Top Cited Scholars
Organizations
About
Scilit
About Us
Advisory Board
Data Sources
Career
Support / Contact
User Guide
Publisher User
Search Function
Rankings Function
API Resource
Scilit Knowledge
Metrics
Scilit Recognitions
Publications Classification
Media
News
Blog
Login
Register
Home
Publications
Dry Etching Technique for Subquarter‐Micron Copper Interconnects
Home
Publications
Dry Etching Technique for Subquarter‐Micron Copper Interconnects
Dry Etching Technique for Subquarter‐Micron Copper Interconnects
Authors:
YI
Yasushi Igarashi
Yasushi Igarashi
TY
Tomomi Yamanobe
Tomomi Yamanobe
TI
Toshio Ito
Toshio Ito
Article Alert
Citation Alert
Add to Library
Cite
Download
Share
Download
Publisher website
Google Scholar
1 March 1995
journal article
Published by
The Electrochemical Society
in
Journal of the Electrochemical Society
Vol. 142
(3)
,
L36-L37
DOI:
10.1149/1.2048577
Abstract
No abstract available
Keywords
COPPER
Cited
Cited by 20 articles
Scroll to top