Relations between plasma properties and properties of thin copper films produced by an anodic vacuum arc
Authors:
- M. MausbachMMM. Mausbach
- H. EhrichHEH. Ehrich
- K.G. MüllerKMK.G. Müller
- 7 July 1991
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 140, 825-829
Abstract
No abstract availableThis publication has 13 references indexed in Scilit:
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