Effect of the evolution of phenol–formaldehyde resin on the high-temperature bonding
Authors:
- Jigang WangJWJigang Wang
- Nan JiangNJNan Jiang
- Haiyun JiangHJHaiyun Jiang
- 1 October 2009
- journal article
- Published by Elsevier in International Journal of Adhesion and Adhesives
- Vol. 29 (7) , 718-723
Abstract
No abstract availableThis publication has 13 references indexed in Scilit:
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