Large-Area Die-Attachment Sintered by Organic-Free Ag Sintering Material at Low Temperature
- 23 August 2019
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 48 (11) , 7562-7572
Abstract
No abstract availableKeywords
Funding Information
- National Natural Science Foundation of China (51520105007, 51775299)
- National Key Research and Development Program of China (2017YFB1104900)
This publication has 2 references indexed in Scilit:
- Effect of Gold on the Microstructural Evolution and Integrity of a Sintered Silver JointJournal of Electronic Materials, 2017
- Microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (DBC) and copper substrates aged at 300 °CJournal of Alloys and Compounds, 2016