Abstract
Thermal stability of sputtered CoSi2 and TiN and reactive sputtered TiN contacts on n-Si were examined. It was determined that reactively sputtered contacts with 70% Ar and 30% N2 have better properties than the other two contacts. CoSi2 contacts were found stable except a sharp increase in their reverse current was observed when annealed at temperature higher than 850°C.

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