Resolution Enhanced Array ECT Probe for Small Defects Inspection

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Abstract
It is a continual and challenging problem to detect small defects in metallic structures for array eddy current testing (ECT) probes, which require the probe to have ultra-high resolution and sensitivity. However, the spatial resolution of an ECT array probe is limited by the size of the induction coils. Even if it is possible to increase the spatial resolution by using smaller coils, the sensitivity of the sensor also decreases. To obtain finer spatial resolution without sacrificing sensitivity, this paper proposes a resolution enhanced ECT array probe with four rows of coils attached to a flexible printed circuit board (FPCB). The distance between each two adjacent coils in a row is 2 mm and the position of each row is offset by 0.5 mm along the horizontal direction related to its prior row. The outputs of the four rows are aligned and interpolated in a line, and in this way the image resolution of the probe is increased to 0.5 mm. The probe is configured to operate with the differential setting, namely two differential coils operate simultaneously at each time. The currents in the two coils can be controlled to have the same flowing direction or opposite flowing direction, resulting in different distributions of the induced eddy current and two sets of output images. A patch-image model and an image fusion method based on discrete wavelet transforms are employed to suppress the noise and highlight the defects’ indications. Experimental results show that small defects with dimensions as small as length × width × depth = 1 mm × 0.1 mm × 0.3 mm on a 304 stainless-steel sample can be detected from the fused image, demonstrating that the probe has super sensitivity for small defects inspection.

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