Failure analysis of solder bumped flip chip on low-cost substrates
Authors:
- J.H. LauJLJ.H. Lau
- C. ChangCCC. Chang
- S.-W.R. LeeSLS.-W.R. Lee
- 1 January 2000
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electronics Packaging Manufacturing
- Vol. 23 (1) , 19-27
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
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