Additive-Free Superfilling in Damascene Cu Electrodeposition Using Microcontact Printing
Authors:
- Soo-Kil KimSKSoo-Kil Kim
- Jae Jeong KimJKJae Jeong Kim
- 1 January 2004
- journal article
- Published by The Electrochemical Society in Electrochemical and Solid-State Letters
- Vol. 7 (9) , C101-C103
Abstract
To avoid complications brought about by employing organic additives, microcontact printing using a flat stamp was used in forming trench-selective Cu superfilling on damascene structure. Self-assembled monolayers of 1-decanethiol transferred on top surface of the trench could withstand the electrolyte and were used as a barrier for current transfer below a certain potential that was not yet dominated by the tunneling current. Subsequent electrodeposition on the printing area was successfully inhibited. The resulting filling profile was a defect-free superfilling with bumps on top. This is comparable to the three-additive system consisting of accelerator and two-component suppressor. © 2004 The Electrochemical Society. All rights reserved.Keywords
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