Electromigration interconnect lifetime under AC and pulse DC stress
Authors:
- B.K. LiewBLB.K. Liew
- N.W. CheungNCN.W. Cheung
- C. HuCHC. Hu
- 1 January 1989
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 215-219
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Electromigration transport mobility associated with pulsed direct current in fine-grained evaporated Al-0.5%Cu thin filmsJournal of Applied Physics, 1983
- A model of electromigration failure under pulsed conditionJournal of Applied Physics, 1980
- Effect of structure and processing on electromigration-induced failure in anodized aluminumJournal of Applied Physics, 1973
- ELECTROMIGRATION-INDUCED FAILURES IN ALUMINUM FILM CONDUCTORSApplied Physics Letters, 1970