Effect of high temperature, high pressure annealing on GaN drift layers for vertical power devices
- 1 October 2018
- journal article
- research article
- Published by Elsevier in Journal of Crystal Growth
- Vol. 499, 35-39
Abstract
No abstract availableKeywords
Funding Information
- U.S. Naval Research Laboratory
- American Association for Engineering Education NRL Postdoctoral Fellow Program
- Office of Naval Research
This publication has 21 references indexed in Scilit:
- GaN-on-Si Power Technology: Devices and ApplicationsIEEE Transactions on Electron Devices, 2017
- High-Performance GaN Vertical Fin Power Transistors on Bulk GaN SubstratesIEEE Electron Device Letters, 2017
- Normally OFF Trench CAVET With Active Mg-Doped GaN as Current Blocking LayerIEEE Transactions on Electron Devices, 2016
- 600 V/ $1.7~\Omega$ Normally-Off GaN Vertical Trench Metal–Oxide–Semiconductor Field-Effect TransistorIEEE Electron Device Letters, 2016
- 1.5-kV and 2.2-m \(\Omega \) -cm \(^{2}\) Vertical GaN Transistors on Bulk-GaN SubstratesIEEE Electron Device Letters, 2014
- Activation of Mg implanted in GaN by multicycle rapid thermal annealingElectronics Letters, 2014
- kV-Class GaN-on-Si HEMTs Enabling 99% Efficiency Converter at 800 V and 100 kHzIEEE Transactions on Power Electronics, 2013
- Development of gallium-nitride-based light-emitting diodes (LEDs) and laser diodes for energy-efficient lighting and displaysActa Materialia, 2013
- A Review of GaN on SiC High Electron-Mobility Power Transistors and MMICsIEEE Transactions on Microwave Theory and Techniques, 2012
- Enhancement and Depletion Mode AlGaN/GaN CAVET With Mg-Ion-Implanted GaN as Current Blocking LayerIEEE Electron Device Letters, 2008