Effects of different water-cooled heat sinks on the cooling system performance in a data center
Authors:
- Wei HeWHWei He
- Jifang ZhangJZJifang Zhang
- Hailong LiHLHailong Li
- Rui GuoRGRui Guo
- Shengchun LiuSLShengchun Liu
- Xiaohui WuXWXiaohui Wu
- Jie WeiJWJie Wei
- Yulin WangYWYulin Wang
- 10 May 2023
- journal article
- research article
- Published by Elsevier in Energy and Buildings
- Vol. 292
Abstract
No abstract availableKeywords
Funding Information
- Natural Science Foundation of Tianjin Municipal Science and Technology Commission (18JCZDJC97100)
- Tianjin Municipal Natural Science Foundation
This publication has 35 references indexed in Scilit:
- Effect of climate conditions on the thermodynamic performance of a data center cooling system under water-side economizationEnergy and Buildings, 2020
- Research of an integrated cooling system consisted of compression refrigeration and pump-driven heat pipe for data centersEnergy and Buildings, 2019
- Numerical investigation of fluid flow and heat transfer in a plate microchannel heat exchanger with isosceles trapezoid-shaped reentrant cavities in the sidewallChemical Engineering and Processing - Process Intensification, 2018
- Effect of CRAC units layout on thermal management of data centerApplied Thermal Engineering, 2017
- Effect of raised floor height on different arrangement of under-floor air distribution performance in data centerProcedia Engineering, 2017
- Overview of direct air free cooling and thermal energy storage potential energy savings in data centresApplied Thermal Engineering, 2015
- A combined cooling solution for high heat density data centers using multi-stage heat pipe loopsEnergy and Buildings, 2015
- Optimum supply air temperature ranges of various air-side economizers in a modular data centerApplied Thermal Engineering, 2015
- Thermo-economic analysis of steady state waste heat recovery in data centers using absorption refrigerationApplied Energy, 2015
- Application of Two-Phase Spray Cooling for Thermal Management of Electronic DevicesIEEE Transactions on Components and Packaging Technologies, 2009