Thermal stability enhancement of perovskite MAPbI3 film at high temperature (150 °C) by PMMA encapsulation
Authors:
- 5 May 2021
- journal article
- research article
- Published by Springer Nature in Journal of Materials Science: Materials in Electronics
- Vol. 32 (11) , 14885-14900
Abstract
No abstract availableKeywords
Funding Information
- Universiti Tunku Abdul Rahman (UTARRF/2017-C2/N01)
- Institut Pengurusan dan Pemantauan Penyelidikan, Universiti Malaya (IIRG018B-2019)
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