Electromigration resistance of copper interconnects
Authors:
- D. SaveDSD. Save
- F. BraudFBF. Braud
- J. TorresJTJ. Torres
- F. BinderFBF. Binder
- C. MüllerCMC. Müller
- J.O. WeidnerJWJ.O. Weidner
- W. HasseWHW. Hasse
- 1 January 1997
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 33 (1-4) , 75-84