Electromigration resistance of copper interconnects

Authors:
  • DSD. Save
    D. Save
  • FBF. Braud
    F. Braud
  • JTJ. Torres
    J. Torres
  • FBF. Binder
    F. Binder
  • CMC. Müller
    C. Müller
  • JWJ.O. Weidner
    J.O. Weidner
  • WHW. Hasse
    W. Hasse

Abstract
No abstract available