Reliability of Solder Joint with Sn–Ag–Cu–Ni–Ge Lead-Free Alloy under Heat Exposure Conditions
Authors:
- 1 January 2005
- journal article
- Published by Japan Institute of Metals in MATERIALS TRANSACTIONS
- Vol. 46 (12) , 2737-2744
Abstract
No abstract availableKeywords
This publication has 12 references indexed in Scilit:
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