Ultra low stress and low temperature patternable silicone materials for applications within microelectronics
Authors:
- H. MeynenHMH. Meynen
- M. Vanden BulckeMBM. Vanden Bulcke
- M. GonzalezMGM. Gonzalez
- B. HarknessBHB. Harkness
- G. GardnerGGG. Gardner
- J. Sudbury-HoltschlagJSJ. Sudbury-Holtschlag
- B. VandeveldeBVB. Vandevelde
- C. WintersCWC. Winters
- E. BeyneEBE. Beyne
- 1 October 2004
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 76 (1-4) , 212-218
Abstract
No abstract availableKeywords
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