Electromigration in gold and copper thin film conductors
Authors:
- R.J. MillerRMR.J. Miller
- A. GanguleeAGA. Gangulee
- 1 July 1980
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 69 (3) , 379-386
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- Metallization in microelectronicsThin Solid Films, 1977
- Electrotransport in copper alloy films and the defect mechanism in grain boundary diffusionThin Solid Films, 1975
- Electromigration testing—A current problemMicroelectronics Reliability, 1974
- The activation energy for electromigration and grain-boundary self-diffusion in goldScripta Metallurgica, 1973
- Electromigration in thin gold filmsJournal of Physics F: Metal Physics, 1973
- Electromigration-Induced Failures in, and Microstructure and Resistivity of, Sputtered Gold FilmsJournal of Applied Physics, 1972
- Statistical Metallurgical Model for Electromigration Failure in Aluminum Thin-Film ConductorsJournal of Applied Physics, 1971
- Logical Networks for Feature ExtractionIEEE Transactions on Systems, Man, and Cybernetics, 1971
- Dependence of Electromigration-Induced Failure Time on Length and Width of Aluminum Thin-Film ConductorsJournal of Applied Physics, 1970
- Electromigration in thin gold filmsIEEE Transactions on Electron Devices, 1969