Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn–xCu solders during multiple reflows
- 23 October 2017
- journal article
- research article
- Published by Springer Nature in Journal of Materials Science: Materials in Electronics
- Vol. 29 (1) , 602-613
Abstract
No abstract availableKeywords
Funding Information
- National Natural Science Foundation of China (CN) (51571049, 51675080)
- China Postdoctoral Science Foundation (CN) (2017M611215)
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