Insight into the bonding mechanism in Cu/Al/Cu clad sheets via introduction of thin SUS304 interlayer
Authors:
- Jing LiJLJing Li
- Haitao GaoHGHaitao Gao
- Charlie KongCharlie Kong
- Hailiang YuHailiang Yu
Open Access
- 17 November 2022
- journal article
- research article
- Published by Elsevier in Journal of Materials Research and Technology
- Vol. 21, 4619-4635
Abstract
No abstract availableKeywords
Funding Information
- National Natural Science Foundation of China (52105419)
- Central South University (2019CX006)
- China Postdoctoral Science Foundation (2022M713505, 2022T150736)
- Natural Science Foundation of Hunan Province (2022JJ40596)
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