A model of aging of dielectric extruded cables
Authors:
- J.P. CrineJCJ.P. Crine
- J.L. ParpalJPJ.L. Parpal
- G. LessardGLG. Lessard
- 13 January 2003
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 347-351
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Study on Improvements to the Dielectric Breakdown Strength of Extruded Dielectric CablesIEEE Transactions on Power Apparatus and Systems, 1985
- A General Approach to the Endurance of Electrical Insulation under Temperature and VoltageIEEE Transactions on Electrical Insulation, 1981