Driving Force and Mechanism for Spontaneous Metal Whisker Formation
Authors:
- 10 November 2004
- journal article
- research article
- Published by American Physical Society (APS) in Physical Review Letters
- Vol. 93 (20) , 206104
Abstract
The room temperature spontaneous growth of low melting point metal whiskers, such as Sn, poses a serious reliability problem in the semiconducting industry; a problem that has become acute with the introduction of Pb-free technology. To date, this year old problem has resisted interpretation. Herein we show that the driving force is essentially a reaction between oxygen and the sprouting metal. The resulting volume expansion creates a compressive stress that pushes the whiskers up. The model proposed explains our observations on In and Sn whiskers and many past observations. The solution is in principle simple: diffusion of oxygen into the metal must be prevented or slowed down. This was demonstrated by coating the active surfaces with a polymer coating.
Keywords
This publication has 20 references indexed in Scilit:
- Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffractionActa Materialia, 2003
- Six cases of reliability study of Pb-free solder joints in electronic packaging technologyMaterials Science and Engineering: R: Reports, 2002
- Growing Metallic Whiskers: Alternative InterpretationScience, 1999
- Room-Temperature Deintercalation and Self-Extrusion of Ga from Cr 2 GaNScience, 1999
- Spontaneous growth mechanism of tin whiskersActa Materialia, 1998
- Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactionsPhysical Review B, 1994
- Interdiffusion and reaction in bimetallic Cu-Sn thin filmsActa Metallurgica, 1973
- Growth Mechanism of Proper Tin-WhiskerJapanese Journal of Applied Physics, 1969
- Accelerated growth of tin whiskersActa Metallurgica, 1954
- A Tentative Theory of Metallic Whisker GrowthPhysical Review B, 1953